Technical
Product Model
DHI-SSD-C900VN256G
DHI-SSD-C900VN512G
DHI-SSD-C900VN1TB
DHI-SSD-C900VN2TB
Capacity1
256 GB
512 GB
1 TB
2 TB
Form Factor
M.2 2280
Port
PCIe Gen 3.0 x 4
Net Weight
Max. 8 g (0.02 lb)
Product Dimensions2
80.00 mm × 23.00 mm × 4.80 mm (3.15" × 0.91" × 0.19")
Packaging Dimensions
130 mm × 104 mm × 17 mm (5.12" × 4.09" × 0.67")
Memory Component
3D NAND FLASH
Power Consumption3
2.8 W (max); 0.17 W (idle)
3.689 W (max); 0.611 W (idle)
3.95 W (max); 0.05 W (idle)
4.15 W (max); 0.06 W (idle)
S.M.A.R.T
Yes
TRIM
Yes
Garbage Collection
Yes
Sequential Read3
Up to 3,300 MB/s
Up to 3,300 MB/s
Up to 3,400
MB/s
Up to 3,400
MB/s
Sequential Write3
Up to 1,200
MB/s
Up to 2,700
MB/s
Up to 3,000
MB/s
Up to 3,000
MB/s
4K Random Read3
Up to 124400
Up to 175800
Up to 151200
Up to 544300
4K Random Write3
Up to 177900
Up to 113900
Up to 90600
Up to 403900
MTBF
1,500,000 hours
Operating Temperature
0 °C to +70 °C (+32 °F to +158 °F)
Storage Temperature
–40 °C to +85 °C (–40 °F to +185 °F)
Operating Humidity
5%–95% (non-condensing)
Vibration Resistance
10–200Hz, 0.5G
Shock Resistance
1,500 G/0.5 ms (half sine wave)
TBW
128 TB
256 TB
512 TB
2000 TB
Warranty4
3-year limited warranty
Reference Information
1. Capacity calculation: 1GB = 1 billion bytes (IDEMA). Actual available capacity might be reduced (due to formatting, partition, operating system applications, or other necessary usage).
2. System configuration of performance test: Chip-Intel Z270 Chipset, Intel Core , 8GB DDR4; operating system-Windows 10 x64; testing tool-CrystalDiskMark 8.11.2.
3. Warranty period or maximum write amount (TBW), whichever
comes first.
4. High performance SLC cache has been enabled.
*Above data based on internal testing of Zhejiang Huayixin Technology Co., Ltd Laboratory.
Product Model
DHI-SSD-C900VN256G
DHI-SSD-C900VN512G
DHI-SSD-C900VN1TB
DHI-SSD-C900VN2TB
Capacity1
256 GB
512 GB
1 TB
2 TB
Form Factor
M.2 2280
Port
PCIe Gen 3.0 x 4
Net Weight
Max. 8 g (0.02 lb)
Product Dimensions2
80.00 mm × 23.00 mm × 4.80 mm (3.15" × 0.91" × 0.19")
Packaging Dimensions
130 mm × 104 mm × 17 mm (5.12" × 4.09" × 0.67")
Memory Component
3D NAND FLASH
Power Consumption3
2.8 W (max); 0.17 W (idle)
3.689 W (max); 0.611 W (idle)
3.95 W (max); 0.05 W (idle)
4.15 W (max); 0.06 W (idle)
S.M.A.R.T
Yes
TRIM
Yes
Garbage Collection
Yes
Sequential Read3
Up to 3,300 MB/s
Up to 3,300 MB/s
Up to 3,400
MB/s
Up to 3,400
MB/s
Sequential Write3
Up to 1,200
MB/s
Up to 2,700
MB/s
Up to 3,000
MB/s
Up to 3,000
MB/s
4K Random Read3
Up to 124400
Up to 175800
Up to 151200
Up to 544300
4K Random Write3
Up to 177900
Up to 113900
Up to 90600
Up to 403900
MTBF
1,500,000 hours
Operating Temperature
0 °C to +70 °C (+32 °F to +158 °F)
Storage Temperature
–40 °C to +85 °C (–40 °F to +185 °F)
Operating Humidity
5%–95% (non-condensing)
Vibration Resistance
10–200Hz, 0.5G
Shock Resistance
1,500 G/0.5 ms (half sine wave)
TBW
128 TB
256 TB
512 TB
2000 TB
Warranty4
3-year limited warranty
Reference Information
1. Capacity calculation: 1GB = 1 billion bytes (IDEMA). Actual available capacity might be reduced (due to formatting, partition, operating system applications, or other necessary usage).
2. System configuration of performance test: Chip-Intel Z270 Chipset, Intel Core , 8GB DDR4; operating system-Windows 10 x64; testing tool-CrystalDiskMark 8.11.2.
3. Warranty period or maximum write amount (TBW), whichever
comes first.
4. High performance SLC cache has been enabled.
*Above data based on internal testing of Zhejiang Huayixin Technology Co., Ltd Laboratory.
Catégories:
Composants PC fixe
Région:
ALGER /
ALGERIE
Publiée le:
19-04-2026 à 16:13:25
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