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Product Selector
Technical
Product Model
DHI-SSD-C900N256G
Capacity1
256 GB
Form Factor
M.2 2280
Port
PCIe Gen 3.0 × 4
Net Weight
Max. 8 g (0.02 lb)
Product Dimensions
80.00 mm × 22.00 mm × 2.25 mm (3.15" × 0.87" × 0.09")
Packaging Dimensions
130 mm × 104 mm × 17 mm (5.12" × 4.09" × 0.67")
Memory Component
3D NAND
Power Consumption2
3066 mW (max)
566 mW (idle)
2950 mW (max)
528 mW (idle)
3521 mW (max)
1188 mW (idle)
3696 mW (max)
1188 mW (idle)
S.M.A.R.T
Yes
TRIM
Yes
Garbage Collection
Yes
Sequential Read2
Up to 2000 MB/s
Up to 2000
MB/s
Up to 2000 MB/s
Up to 2000 MB/s
Sequential Write2
Up to 650
MB/s
Up to 1050
MB/s
Up to 1500 MB/s
Up to 1600 MB/s
4K Random Read2
Up to 58800
Up to 88300
Up to 99500
Up to 96200
4K Random Write2
Up to 102400
Up to 95400
Up to 96200
Up to 91300
MTBF
1,500,000 hours
Operating Temperature
0 °C to +70 °C (+32 °F to +158 °F)
Storage Temperature
–40 °C to +95 °C (–49 °F to +203 °F)
Operating Humidity
5%–95% (non-condensing)
Vibration Resistance
10-200Hz, 0.5 G
Shock Resistance
1500G&0.5 ms (half sine wave)
TBW
80 TB
128 TB
256 TB
512 TB
Warranty3
3-year limited warranty
Reference Information
1.Capacity calculation: 1 GB = 1 billion bytes (IDEMA). Actual available capacity might be reduced (due to formatting, partition, operating system applications, or other necessary usage).
2. System configuration of performance test: Chip-AMD Ryzen 5 5600X 6-Core GHz, 8G-DDR4, operating system-Windows 10 x64, testing tool-CrystalDiskMark 6.0.0 x64.
3.Warranty period or maximum write amount (TBW), whichever comes first.
4.High performance SLC cache has been enabled.
*Above data based on internal testing of Zhejiang Huayixin Technology Co., Ltd Laboratory The actual performance might differ depending on the device it is being used with.
Product Selector
Technical
Product Model
DHI-SSD-C900N256G
Capacity1
256 GB
Form Factor
M.2 2280
Port
PCIe Gen 3.0 × 4
Net Weight
Max. 8 g (0.02 lb)
Product Dimensions
80.00 mm × 22.00 mm × 2.25 mm (3.15" × 0.87" × 0.09")
Packaging Dimensions
130 mm × 104 mm × 17 mm (5.12" × 4.09" × 0.67")
Memory Component
3D NAND
Power Consumption2
3066 mW (max)
566 mW (idle)
2950 mW (max)
528 mW (idle)
3521 mW (max)
1188 mW (idle)
3696 mW (max)
1188 mW (idle)
S.M.A.R.T
Yes
TRIM
Yes
Garbage Collection
Yes
Sequential Read2
Up to 2000 MB/s
Up to 2000
MB/s
Up to 2000 MB/s
Up to 2000 MB/s
Sequential Write2
Up to 650
MB/s
Up to 1050
MB/s
Up to 1500 MB/s
Up to 1600 MB/s
4K Random Read2
Up to 58800
Up to 88300
Up to 99500
Up to 96200
4K Random Write2
Up to 102400
Up to 95400
Up to 96200
Up to 91300
MTBF
1,500,000 hours
Operating Temperature
0 °C to +70 °C (+32 °F to +158 °F)
Storage Temperature
–40 °C to +95 °C (–49 °F to +203 °F)
Operating Humidity
5%–95% (non-condensing)
Vibration Resistance
10-200Hz, 0.5 G
Shock Resistance
1500G&0.5 ms (half sine wave)
TBW
80 TB
128 TB
256 TB
512 TB
Warranty3
3-year limited warranty
Reference Information
1.Capacity calculation: 1 GB = 1 billion bytes (IDEMA). Actual available capacity might be reduced (due to formatting, partition, operating system applications, or other necessary usage).
2. System configuration of performance test: Chip-AMD Ryzen 5 5600X 6-Core GHz, 8G-DDR4, operating system-Windows 10 x64, testing tool-CrystalDiskMark 6.0.0 x64.
3.Warranty period or maximum write amount (TBW), whichever comes first.
4.High performance SLC cache has been enabled.
*Above data based on internal testing of Zhejiang Huayixin Technology Co., Ltd Laboratory The actual performance might differ depending on the device it is being used with.
Catégories:
Composants PC fixe
Région:
ALGER /
ALGERIE
Publiée le:
27-09-2025 à 13:47:39
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