High speed up to 3200MHz
Transfer bandwidth up to 25.6GB/s
Energy efficient: saves 20% power compared to DDR3
8-layer PCB provides improved signal transfer and
system stability
Supports Intel® Core™ 8th/9th/10th series and
AMD® ZEN 2nd 3rd Ryzen™ series
Specifications
Module: 288-pin DIMM
Densities: 8GB / 16GB / 32GB
Power supply: VDD and +0.06/-0.06V
DRAM activation power supply:
VPP = 2.5V (+0.25V / -0.125V)
DRAM VCC: DDR4 STD 1.2V
Operating temperature: 0°C to 85°C
Warranty: limited lifetime
Transfer bandwidth up to 25.6GB/s
Energy efficient: saves 20% power compared to DDR3
8-layer PCB provides improved signal transfer and
system stability
Supports Intel® Core™ 8th/9th/10th series and
AMD® ZEN 2nd 3rd Ryzen™ series
Specifications
Module: 288-pin DIMM
Densities: 8GB / 16GB / 32GB
Power supply: VDD and +0.06/-0.06V
DRAM activation power supply:
VPP = 2.5V (+0.25V / -0.125V)
DRAM VCC: DDR4 STD 1.2V
Operating temperature: 0°C to 85°C
Warranty: limited lifetime
الفئات:
إعلام آلي وهواتف
المنطقة:
جلفة /
الجزائر
وضع في:
17-08-2025 à 11:50:48
